CEDaCI OEM Questionnaire

Co-financed by the European Regional Development Fund, the CEDaCI Project is developing the circularity solutions to decrease the environmental impact of the IT equipment used by the Data Centre Industry. All the key findings and deliverables of CEDaCI Project will be made publicly available on www.cedaci.org to help the DCI in their journey towards the circularity. Your details and the information collected will remain confidential.

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* 1. Do you design equipment for the upcycling and reuse?

Yes, we design with both in mind.

Yes, but we only consider the reusability of the equipment.

Our main focus is on functionality and performance, but we are currently looking into upcycling and reuse.

No, not really. Our main focus is on functionality and performance.

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* 2. How many times can the equipment be upcycled and re-used before completely failing? Within a life cycle of a single component, how many times (on average) can it be re-used before it fails?

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* 3. Do you take back old equipment for upscaling and remanufacture? What is the re-use rate of functioning components from used equipment that had been returned to you?

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* 4. How long does it take to develop new equipment: from concept to product? What is the average manufacturing cycle time for your products?

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* 5. What components are assembled at the factory and which are outsourced to the “White Label” manufacturers?

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* 6. Can the service-based business model completely eliminate the need for businesses to purchase the equipment, therefore encouraging OEMs to keep everything in-house, making the industry inevitably more circular?

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* 7. Have you considered adopting a service-based business model in the nearest future? If yes, how long will the transition take?

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* 8. Many parts are designed to be hot-swappable, but they are difficult to disassemble for repair on the sub-assembly level. Why isn’t everything made for easy disassembly?

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* 9. Enclosures, fasteners, slots and connectors of many parts, are often different in different generations and models of equipment. Have OEMs considered a more fit-for-all design approach?

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* 10. Where can we find full data on CRM content of the PCB components as openly available Technical Specification Sheets contain limited information?